small signal product - fast switching speed - surface mount device type - high conductance - for general purpose switching applications - packing code with suffix "g" means green compound (halogen-free) - case: sot-23 small outline plastic package - weight: 8 0.5 mg - bas19 marking code: jp - bas20 marking code: jr symbol unit v rm v i o ma p d mw r ja o c/w t j , t stg o c electrical characteristics symbol unit c j pf t rr ns document number: ds_s1412038 version: b14 reverse breakdown voltage i f = i r = 30 ma , i rr = 0.1 i r v r = 0 v , f = 1.0 mhz i f = 200 ma i f = 100 ma bas20 v r = 150 v bas19 v r = 100 v bas20 i r = 100 a bas19 i r = 100 a 50.0 5 1.25 1.0 reverse recovery time junction capacitance forward voltage max min 100 - - - - 150 - 0.1 150 100 -65 to +150 500 250 200 v v f a i r peak reverse current v v r(br) operating and storage temperature range parameter power dissipation thermal resistance junction to ambient air working peak reverse voltage dc blocking voltage average rectifier output current - terminal: matte tin plat ed, lead free., solderable per mil-std-202, method 208 guaranteed - high temperature soldering guaranteed : 260c/10s maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter bas19 bas20 bas19 / bas20 taiwan semiconductor surface mount fast switching diode features sot-23 mechanical data
small signal product (t a =25c unless otherwise noted) document number: ds_s1412038 version: b14 bas19 / bas20 taiwan semiconductor ratings and characteristics curves 0.01 0.1 1 10 100 0 100 200 i r , leakage current ( a) t j , junction temperature ( o c) fig. 2 leakage current vs. junction temperature 0.01 0.1 1 10 100 1000 012 i f , instantaneous forward current (ma) v f , instantaneous forward voltage (v) fig. 1 forward characteristics
ordering information part no. note 1: "xx" is device code from "19" thru "20". note 2: part no. suffix ?-xx ? would be used for special requirement part no. package outline dimensions min max min max a 2.70 3.10 0.106 0.122 b 1.10 1.50 0.043 0.059 c 0.30 0.51 0.012 0.020 d 1.78 2.04 0.070 0.080 e 2.10 2.64 0.083 0.104 f 0.89 1.30 0.035 0.051 g h suggest pad layout z x y c e document number: ds_s1412038 version: b14 1.0 0.039 0.7 0.028 0.9 0.035 1.9 0.075 dim. unit (mm) unit (inch) typ. typ. 2.8 0.110 dim. unit (mm) unit (inch) 0.55 ref 0.022 ref 0.10 ref 0.004 ref bas19-b0 rfg bas19 -b0 rf g defined manufacture source green compound bas19 rfg bas19 rf g multiple manufacture source green compound bas19 rf bas19 rf multiple manufacture source example preferred p/n part no. suffix packing code packing code suffix description basxx (note 1) -xx rf gsot-23 3k / 7" reel r5 10k / 13" reel bas19 / bas20 taiwan semiconductor small signal product part no. suffix (note 2) packing code packing code suffix package packing
small signal product assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_s1412038 version: b14 bas19 / bas20 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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